Display device and method of manufacturing the same

ABSTRACT

Disclosed are a display device and a method of manufacturing a display device. The method of a display device according to an exemplary embodiment of the present disclosure includes: a first transferring step of transferring a plurality of LEDs disposed on a wafer onto a plurality of donors; and a second transferring step of transferring the plurality of LEDs transferred onto the plurality of donors onto a display panel, in which in the second transferring step, an area where one of the plurality of donors overlaps the display panel partially overlaps an area where the other one of the plurality of donors overlaps the display panel. Therefore, the plurality of LEDs having different wavelengths is uniformly transferred to reduce a boundary caused by the difference in wavelengths and improve color uniformity.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2017-0155086 filed on Nov. 20, 2017, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND Technical Field

The present disclosure relates to a display device and a method ofmanufacturing the same, and more particularly, to a display device usinga light emitting diode (LED) with an improved light uniformity and amethod of manufacturing the same.

Description of the Related Art

An applicable range of the liquid crystal display device (LCD) and theorganic light emitting display device (OLED) which have been widely useduntil now is gradually expanded.

Due to advantages of the liquid crystal display device and the organiclight emitting display device such as a high resolution screen, a smallthickness, and light-weight, the liquid crystal display device and theorganic light emitting display device are widely applied to screens ofeveryday electronic devices such as mobile phones or notebooks and theapplication range thereof is gradually expanded.

However, the liquid crystal display device and the organic lightemitting display device have a limitation in reducing a size of a bezelarea which is visibly recognized by a user as an area in which an imageis not displayed. For example, in the case of the liquid crystal displaydevice, a sealant needs to be used to seal the liquid crystal and bondan upper substrate and a lower substrate. Thus, there is a limitation inreducing the size of the bezel area. Further, in the case of the organiclight emitting display device, an organic light emitting element whichis formed of an organic material is vulnerable to moisture or oxygen sothat an encapsulating unit needs to be disposed to protect the organiclight emitting element. Therefore, there is a limitation in reducing thesize of the bezel area. Specifically, it is difficult to implement avery large screen by one panel. Therefore, when the very large screen isimplemented by disposing a plurality of liquid crystal display panels ora plurality of organic light emitting display panels in the form oftiles, bezel areas between adjacent panels may be visibly recognized bythe user.

A display device including an LED has been suggested as an alternativeto this. Since the LED is formed of an inorganic material, rather thanan organic material, reliability is excellent so that a lifespan thereofis longer than the liquid crystal display device or the organic lightemitting display device. Further, the LED is suitable for a very largescreen because it has a fast lighting speed, low power consumption, andexcellent stability due to high impact resistance and displays an imagehaving high luminance.

In order to manufacture a display device including such an LED, aprocess of growing an LED on a wafer, transferring the LED on the waferonto a donor, and then transferring the LED which is transferred ontothe donor onto a substrate of a display device is used.

SUMMARY

In order to manufacture an LED, a plurality of LEDs which emits light ofthe same color is grown on one wafer. The LED which has been completelygrown on the wafer is primarily transferred onto a donor and thensecondarily transferred from the donor onto a display panel so that theLEDs are disposed on the display panel.

However, in a plurality of LEDs which is grown on one wafer to emitlight of the same color, wavelengths of light actually emitted fromindividual LEDs are slightly different due to a process error. However,the human eye can perceive a small amount of difference of thewavelengths of light, for example, even though there is just adifference of 2 nm, the human eye can perceive the difference.Therefore, when the LED is transferred from the wafer onto the donor,and from the donor onto the display panel by one to one, uneven colordue to the difference of wavelengths of light emitted from the LEDs maybe undesirably perceived by viewers.

The inventors of the present disclosure recognized that the wavelengthsof light of a plurality of LEDs which is grown on one wafer to emitlight of the same color as described above are slightly different due toa process error. Therefore, the inventors of the present disclosureinvented a display device with a new structure in which color uniformityis improved regardless of the process error occurring during the growthof the LEDs and a new method of manufacturing a display device.

Accordingly, embodiments of the present disclosure are directed to adisplay device and a method of manufacturing the same that substantiallyobviate one or more of the problems due to limitations and disadvantagesof the related art.

An object of the present disclosure is to provide a display device withan improved color uniformity and a method of manufacturing a displaydevice.

Another object of the present disclosure is to provide a display devicewhich reduces a manufacturing cost by improving an allowable range of awavelength difference of a plurality of LEDs grown on the wafer and amanufacturing method thereof.

Additional features and aspects will be set forth in the descriptionthat follows, and in part will be apparent from the description, or maybe learned by practice of the inventive concepts provided herein. Otherfeatures and aspects of the inventive concepts may be realized andattained by the structure particularly pointed out in the writtendescription, or derivable therefrom, and the claims hereof as well asthe appended drawings.

To achieve these and other aspects of the inventive concepts, asembodied and broadly described, a method of manufacturing a displaydevice comprises a first transferring step of transferring a pluralityof LEDs disposed on a wafer onto a plurality of donors and a secondtransferring step of transferring the plurality of LEDs transferred ontothe plurality of donors onto a display panel, in which in the secondtransferring step, an area where one of the plurality of donors overlapsthe display panel partially overlaps an area where the other one of theplurality of donors overlaps the display panel. Accordingly, a pluralityof LEDs which is grown on one wafer but has uneven wavelengthdistribution due to a process error is uniformly transferred onto thedisplay panel, so that wavelength difference between the plurality ofLEDs due to the uneven wavelength distribution may be lowered and thecolor uniformity may be improved.

In another aspect, a method of manufacturing a display device comprisestransferring some of a plurality of LEDs disposed on a first wafer ontoa first donor, transferring the other of the plurality of LEDs disposedin the first wafer or some of a plurality of LEDs disposed on a secondwafer onto a second donor, transferring the plurality of LEDstransferred onto the first donor in a first area of a display panel, andtransferring the plurality of LEDs transferred onto the second donor ina second area of the display panel, in which the first area and thesecond area at least partially overlap each other to improve coloruniformity between the plurality of LEDs. Accordingly, the coloruniformity may be improved and a manufacturing cost may be reduced.

In another aspect of the present disclosure, a display device comprisesa display panel which includes a plurality of sub-pixels disposed in aplurality of rows and a plurality of columns and a plurality of firstLEDs and a plurality of second LEDs disposed in the plurality ofsub-pixels in which the plurality of first LEDs and the plurality ofsecond LEDs are alternately disposed in a row direction or a columndirection. Accordingly, the plurality of first LEDs and the plurality ofsecond LEDs are alternately disposed so that the color uniformity mayalso be improved.

Other detailed matters of the embodiments are included in the detaileddescription and the drawings.

According to the present disclosure, color uniformity between aplurality of LEDs with uneven wavelength distribution may be improved.

According to the present disclosure, even though there may be adifference in wavelengths of light emitted from a plurality of LEDsgrown on one wafer, the plurality of LEDs is transferred to minimize thewavelength difference between the plurality of LEDs, thereby improvingcolor uniformity.

The effects according to the present disclosure are not limited to thecontents exemplified above, and more various effects are included in thepresent disclosure.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the inventive concepts asclaimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated and constitute apart of this application, illustrate embodiments of the disclosure andtogether with the description serve to explain various principles. Inthe drawings:

FIG. 1 is a flowchart for explaining a display device and a method ofmanufacturing a display device according to an exemplary embodiment ofthe present disclosure;

FIGS. 2A to 2J are schematic views of processes for explaining a displaydevice and a method of manufacturing a display device according to anexemplary embodiment of the present disclosure;

FIGS. 3A to 3G are schematic views of processes for explaining a displaydevice and a method of manufacturing a display device according toanother exemplary embodiment of the present disclosure;

FIGS. 4A to 4H are schematic views of processes for explaining a displaydevice and a method of manufacturing a display device according to stillanother exemplary embodiment of the present disclosure;

FIGS. 5A to 5D are views for explaining effects of a display device anda method of manufacturing a display device according to variousexemplary embodiments of the present disclosure by comparing with adisplay device and a method of manufacturing a display device accordingto a comparative example; and

FIGS. 6A to 6C are views for explaining features of a display deviceaccording to various exemplary embodiments of the present disclosure.

DETAILED DESCRIPTION

Advantages and characteristics of the present disclosure and a method ofachieving the advantages and characteristics will be clear by referringto exemplary embodiments described below in detail together with theaccompanying drawings. However, the present disclosure is not limited toembodiments disclosed herein but will be implemented in various forms.The embodiments are provided by way of example only so that a person ofordinary skilled in the art can fully understand the disclosures of thepresent disclosure and the scope of the present disclosure. Therefore,the present disclosure will be defined only by the scope of the appendedclaims.

The shapes, sizes, ratios, angles, numbers, and the like illustrated inthe accompanying drawings for describing the exemplary embodiments ofthe present disclosure are merely examples, and the present disclosureis not limited thereto. Like reference numerals generally denote likeelements throughout the specification. Further, in the followingdescription, a detailed explanation of known related technologies may beomitted to avoid unnecessarily obscuring the subject matter of thepresent disclosure. The terms such as “including,” “having,” and“consist of” used herein are generally intended to allow othercomponents to be added unless the terms are used with the term “only”.Any references to singular may include plural unless expressly statedotherwise.

Components are interpreted to include an ordinary error range even ifnot expressly stated.

When the position relation between two parts is described using theterms such as “on”, “above”, “below”, and “next”, one or more parts maybe positioned between the two parts unless the terms are used with theterm “immediately” or “directly”.

When an element or layer is disposed “on” another element or layer,another layer or another element may be interposed directly on the otherelement or therebetween.

Although the terms “first”, “second”, and the like are used fordescribing various components, these components are not confined bythese terms. These terms are merely used for distinguishing onecomponent from the other components. Therefore, a first component to bementioned below may be a second component in a technical concept of thepresent disclosure.

Like reference numerals generally denote like elements throughout thespecification.

A size and a thickness of each component illustrated in the drawing areillustrated for the convenience of description, and the presentdisclosure is not limited to the size and the thickness of the componentillustrated.

The features of various embodiments of the present disclosure can bepartially or entirely bonded to or combined with each other and can beinterlocked and operated in technically various ways, and theembodiments can be carried out independently of or in association witheach other.

Hereinafter, the present disclosure will be described in detail withreference to the drawings.

FIG. 1 is a flowchart for explaining a display device and a method ofmanufacturing a display device according to an exemplary embodiment ofthe present disclosure. FIGS. 2A to 2J are schematic views of processesfor explaining a display device and a method of manufacturing a displaydevice according to an exemplary embodiment of the present disclosure.Specifically, FIG. 2A is a plan view of a wafer on which a plurality ofLEDs is disposed. FIG. 2B is a plan view of a donor before the pluralityof LEDs is transferred. FIG. 2C is a schematic cross-sectional view forexplaining a process of transferring a plurality of LEDs disposed on awafer onto a donor. FIG. 2D is a plan view of a first donor onto whichthe plurality of LEDs is completely transferred. FIG. 2E is a plan viewof a second donor onto which the plurality of LEDs is completelytransferred. FIG. 2F is a plan view of a display panel. FIG. 2G is aschematic cross-sectional view for explaining a process of transferringa plurality of LEDs disposed on a donor onto a display panel. FIGS. 2Hto 2J are enlarged plan views of an A area of a display panel forexplaining a process of transferring a plurality of LEDs of a donor ontoa display panel.

First, referring to FIG. 2A, a plurality of LEDs 120 is grown on a wafer110.

The wafer 110 is a substrate on which the LEDs 120 are formed. The LED120 may be formed by depositing a material such as GaN or InGaN whichconfigures the LED 120 on the wafer 110 to grow a crystal layer, cuttingthe crystal layer into individual chips and forming an electrode. Thewafer 110 may be formed of sapphire, SiC, GaN, ZnO, or the like but isnot limited thereto.

A plurality of LEDs 120 which emits light of the same color is formed onone wafer 110. That is, a plurality of LEDs 120 which emits light of thesame color may be formed on each of a plurality of wafers 110,respectively.

In some exemplary embodiments, a plurality of LEDs 120 which emits lightof the different colors may be formed on one wafer 110. For example,LEDs which emit red light, LEDs which emit green light, and LEDs whichemit blue light may be formed on one wafer 110. Hereinafter, for theconvenience of description, it is assumed that a plurality of LEDs 120which emits light of the same color is formed on one wafer 110, but isnot limited thereto.

The LED 120 is a semiconductor device which emits light at the time ofapplying a voltage. The LEDs 120 emit red light, green light, and bluelight and light of various colors including white is implemented bycombination thereof.

In the meantime, the plurality of LEDs 120 includes a plurality of firstLEDs 121 and a plurality of second LEDs 122. The plurality of first LEDs121 and the plurality of second LEDs 122 are disposed in different rowson the wafer 110. For example, the plurality of first LEDs 121 may bedisposed on odd-numbered rows and the plurality of second LEDs 122 maybe disposed on even-numbered rows. In FIG. 2A, even though the pluralityof first LEDs 121 and the plurality of second LEDs 122 are hatched indifferent ways, this is for the convenience of description. Actually,the plurality of first LEDs 121 and the plurality of second LEDs 122 mayemit light of the same color.

In the meantime, the plurality of LEDs 120 may be formed by variousstructures such as a lateral structure, vertical structure, or a flipchip structure.

A lateral LED includes a light emitting layer and an N-type electrodeand a P-type electrode which are horizontally disposed on both sides ofthe light emitting layer. The lateral LED emits light by couplingelectrons supplied to the light emitting layer through the N-typeelectrode and holes supplied to the light emitting layer through theP-type electrode.

A vertical LED includes a light emitting layer and an N-type electrodeand a P-type electrode which are disposed above and below the lightemitting layer, respectively. Similarly to the lateral LED, the verticalLED also emits light by coupling the electrons and holes supplied fromthe electrodes.

A flip-chip LED has the substantially same structure as the lateral LED.However, the flip chip LED may directly bond an electrode to a printedcircuit board by omitting a medium such as a metal wire.

According to the structure of the LED 120, a transferring method mayvary to directly transfer the LED from the wafer 110 to the displaypanel PN or transfer the LED from the wafer 110 to the display panel PNvia the donor 130. For example, the lateral LED may undergo a firsttransferring process from the wafer 110 to the donor 130 and a secondtransferring process from the donor 130 to the display panel PN.Hereinafter, for the convenience of description, it is assumed that theLED 120 has a lateral structure, but is not limited thereto.

A plurality of alignment keys AK is disposed on the wafer 110. Thealignment key AK is a mark for adjusting alignment and parallelismbetween the wafer 110 and the donor 130 when the plurality of LEDs 120of the wafer 110 is transferred onto the donor 130. The alignment key AKmay not be disposed between the plurality of LEDs 120, but may bedisposed to be close to the corner of the wafer 110 at an outerperiphery of the plurality of LEDs 120. However, the alignment key AKmay be disposed in other position than the corner of the wafer 110depending on a design and the number of alignment keys AK may bedetermined in various ways.

When the plurality of LEDs 120 of the wafer 110 is transferred onto thedonor 130, the alignment key AK may be transferred together with theplurality of LEDs 120 or may not be transferred. When the alignment keyAK is transferred onto the donor 130 together with the plurality of LEDs120, a process for aligning the alignment key AK of the donor 130 andthe alignment key AK of the wafer 110 may be simplified.

Referring to FIG. 2B, the donor 130 is a medium for transferring the LED120 of the wafer 110 onto the display panel PN. A size of the donor 130may be similar to a size of the wafer 110 and the plurality of LEDs 120may be transferred from the wafer 110 onto the donor 130 by a lasertransferring method. For example, the donor 130 is directly bonded tothe wafer 110 and then the LED 120 is separated from the wafer 110through a laser lift off (LLO) process to transfer the LED 120 onto thedonor 130.

The donor 130 includes a base layer 131, an adhering layer 132, and aplurality of bumps 133.

The base layer 131 is a substrate which supports the adhering layer 132and the plurality of bumps 133. The base layer 131 may be formed of arigid material to suppress warpage of the adhering layer 132.

The adhering layer 132 is disposed on the base layer 131. On theadhering layer 132, a plurality of LEDs 120 transferred from the wafer110 may be disposed. The adhering layer 132 may be configured by polydimethyl siloxane (PDMS), poly urethane acrylate (PUA), polyethyleneglycol (PEG), polymethylmethacrylate (PMMS), polystyrene (PS), epoxyresin, urethane resin, or acrylic resin, but is not limited thereto.

The plurality of bumps 133 protrudes from the adhering layer 132 to beformed of the same material as the adhering layer 132. The plurality ofLEDs 120 which is transferred from the wafer 110 onto the display panelPN may be transferred onto the plurality of bumps 133, respectively.

The donor 130 includes only the base layer 131 and the adhering layer132 and the plurality of LEDs 120 may be directly transferred onto theadhering layer 132. That is, the donor 130 may not include a separatebump 133. A structure of the donor 130 may vary depending on a shape, anarrangement, and a transferring method of the plurality of LEDs 120, andis not limited thereto. Hereinafter, for the convenience of description,it is assumed that the donor 130 includes a plurality of bumps 133 andthe plurality of LEDs 120 is transferred onto the plurality of bumps133, respectively.

The plurality of bumps 133 includes a plurality of first bumps 134 ontowhich the LEDs 120 are adhered and a plurality of second bumps 135 ontowhich a plurality of alignment keys AK is adhered. As illustrated inFIG. 2B, the plurality of first bumps 134 may be disposed so as tocorrespond to the plurality of LEDs 120 disposed on the wafer 110 one toone. However, the plurality of first bumps 134 may be disposed so as tocorrespond to only some of LEDs 120 on the wafer 110 one to one. Forexample, the first bumps 134 may be disposed in odd-numbered rows on theadhering layer 132 so as to correspond to the plurality of first LEDs121 on the wafer 110 or may be disposed in even-numbered rows on theadhering layer 132 so as to correspond to the plurality of second LEDs122 on the wafer 110. The arrangement of the first bumps 134 may varydepending on a design, and is not limited thereto.

The plurality of second bumps 135 may be disposed so as to correspond tothe plurality of alignment keys AK disposed on the wafer 110 one to one.When a separate alignment key is disposed in the plurality of secondbumps 135, the plurality of alignment keys AK of the wafer 110 and thealignment key of the donor 130 are used to align the wafer 110 and thedonor 130. However, when the plurality of LEDs 120 and the alignmentkeys AK are simultaneously transferred onto the donor 130 from the wafer110, the alignment key AK may be transferred onto the plurality ofsecond bumps 135 from the wafer 110. The arrangement of the second bumps135 may vary depending on a design of the alignment key AK, and is notlimited thereto.

In the meantime, a plurality of donors 130 may be configured. Forexample, a first donor 130A and a second donor 130B may be used. Theplurality of first LEDs 121 of the wafer 110 may be transferred onto thefirst donor 130A and the plurality of second LEDs 122 may be transferredonto the second donor 130B.

Next, the plurality of LEDs 120 disposed on the wafer 110 is primarilytransferred onto the plurality of donors 130 (S100).

Referring to FIG. 2C, the plurality of LEDs 120 of the wafer 110 istransferred onto the donor 130. Specifically, the wafer 110 is disposedon the donor 130 such that upper surfaces of the plurality of bumps 133of the donor 130 are opposite to upper surfaces of the plurality of LEDs120 of the wafer 110. Further, among the plurality of LEDs 120 of thewafer 110, laser is irradiated only onto LEDs 120 to be transferred ontothe donor 130. The LED 120 onto which the laser is irradiated isseparated from the wafer 110 to be adhered onto the plurality of bumps133 of the donor 130. Thereafter, when the plurality of LEDs 120 iscompletely transferred, the donor 130 and the wafer 110 may beseparated.

However, in FIG. 2C, it is illustrated that when the plurality of LEDs120 is primarily transferred from the wafer 110 onto the donor 130, alaser lift-off method is used. However, various transferring methodssuch as an anchor structure method may be used and are not limitedthereto.

Referring to FIG. 2D, the plurality of first LEDs 121 among theplurality of LEDs 120 of the wafer 110 is transferred onto the firstdonor 130A.

Specifically, among the plurality of LEDs 120 disposed on the wafer 110,a plurality of LEDs 120 disposed in odd-numbered lines may betransferred onto the first donor 130A. Therefore, only the plurality offirst LEDs 121 among the plurality of LEDs 120 disposed on the wafer 110is transferred onto the first donor 130A so that the plurality of firstLEDs 121 may be disposed only on the plurality of first bumps 134disposed in odd-numbered rows among the plurality of first bumps 134 ofthe first donor 130A.

Further, the plurality of first alignment keys AK1 may be disposed onthe plurality of second bumps 135 close to the corner of the first donor130A. However, the first alignment key AK1 of the second bump 135 may betransferred from the wafer 110 or the first alignment key AK1 may bealready disposed before transferring the plurality of first LEDs 121onto the first donor 130A.

Referring to FIG. 2E, the plurality of second LEDs 122 among theplurality of LEDs 120 of the wafer 110 is transferred onto the seconddonor 130B. Among the plurality of LEDs 120 disposed on the wafer 110,the plurality of LEDs 120 which is disposed on even-numbered linesdifferent from the lines transferred onto the first donor 130A may betransferred onto the second donor 130B. In FIGS. 2D and 2E, it isillustrated that the plurality of first LEDs 121 in the odd-numberedlines among the plurality of LEDs 120 is transferred onto the firstdonor 130A and the plurality of second LEDs 122 in the even-numberedlines among the plurality of LEDs 120 is transferred onto the seconddonor 130B. In contrast, the plurality of second LEDs 122 in theeven-numbered lines among the plurality of LEDs 120 may be transferredonto the first donor 130A and the plurality of first LEDs 121 in theodd-numbered lines among the plurality of LEDs 120 may be transferredonto the second donor 130B.

Therefore, only the plurality of second LEDs 122 among the plurality ofLEDs 120 disposed on the wafer 110 is transferred onto the second donor130B so that the plurality of second LEDs 122 may be disposed only onthe plurality of first bumps 134 disposed in even-numbered rows amongthe plurality of first bumps 134 of the second donor 130B.

Further, the plurality of second alignment keys AK2 may be disposed onthe plurality of second bumps 135B close to the corner of the seconddonor 130B. However, the second alignment key AK2 of the second bump135B may be transferred from the wafer 110 or the second alignment keyAK2 may be already disposed before transferring the plurality of secondLEDs 122 onto the second donor 130B.

Accordingly, the plurality of first LEDs 121 and second LEDs 121 grownon one wafer 110 may be separately transferred onto the first donor 130Aand the second donor 130B, respectively.

In FIGS. 2C to 2E, even though it is described that one LED 120 istransferred onto one bump 133 of the donor 130, the first transferringmay be performed to transfer the plurality of LEDs 120 on the one bump133.

Next, after the plurality of LEDs 120 is completely transferred onto theplurality of donors 130, the plurality of LEDs 120 transferred onto theplurality of donors 130 is secondarily transferred onto the displaypanel PN (S200).

Referring to FIG. 2F, the display panel PN includes a display area AAand a non-display area NA.

The display panel PN is a panel in which an image is implemented.Display elements for implementing an image, circuits, wiring lines, andcomponents for driving the display elements may be disposed in thedisplay panel.

In the display area AA, a plurality of pixels is disposed and images aredisplayed. In the display area AA, the display elements for displayingimages and circuit units for driving the display elements may bedisposed. In this case, the display elements are LEDs 120 and aplurality of LEDs 120 which emits light of different colors is disposedin the plurality of pixels to implement images.

The circuit units may include various thin film transistors, capacitors,and wiring lines for driving the LEDs 120. For example, the circuitunits may include various configurations such as a thin film transistor,a storage capacitor, a gate line, and a data line, but are not limitedthereto.

In the non-display area NA, wiring lines and components for driving thedisplay elements of the display area AA are disposed and the images arenot displayed and circuits. In the non-display area NA, various ICs suchas a gate driver IC and a data driver IC and driving circuits may bedisposed.

In the meantime, in the case of the display panel PN using the pluralityof LEDs 120, the plurality of display panels PN is disposed in a tilepattern to be suitable for implementing tiling display. Specifically, aninterval between an outermost LED 120 of one display panel PN and anoutermost LED 120 of another adjacent display panel PN may beimplemented to be equal to the intervals of the plurality of LEDs 120 inone display panel PN. Therefore, the display panel PN may implement zerobezel in which a bezel area does not substantially exist so that aboundary between the display panels PN may not be perceived in thetiling display and the image may be clearly implemented. Accordingly, inthe display device and the method of manufacturing a display deviceaccording to the exemplary embodiment of the present disclosure, thedisplay panel PN may not include the non-display area NA and it may bedefined that only the display area AA is disposed in the entire displaypanel PN. Further, various ICs such as a gate driver IC or a data driverIC and various components such as a driving circuit may be disposed on arear side of the display panel PN.

The plurality of LEDs 120 is transferred in the plurality of first areasAR1 and the plurality of second areas AR2 of the display panel PN.

The first area AR1 is an area where the plurality of first LEDs 121 ofthe first donor 130A is transferred and a plurality of first areas AR1may overlap the entire display area AA. Specifically, the plurality offirst areas AR1 is disposed in a row direction and a column direction inthe display area AA. For example, the A area A represented by a boldsolid line in FIG. 2F is the same area as one first area AR1 among theplurality of first areas AR1.

The second area AR2 is an area where the plurality of second LEDs 122 ofthe second donor 130B is transferred and a plurality of second areas AR2may overlap the entire display area AA and a part of the non-displayarea NA. Specifically, the plurality of second areas AR2 is disposed inthe row direction and the column direction in the display area AA andthe non-display area NA and the plurality of second areas AR2 mayoverlap the plurality of first areas AR1. For example, the second areaAR2 is represented by a dotted line in FIG. 2F.

In the meantime, a first row in the plurality of first areas AR1 and afirst row in the plurality of second areas AR2 may be different fromeach other even though they are the same first row. The first row in theplurality of second areas AR2 may be disposed more outwardly than thefirst row in the plurality of first areas AR1. Therefore, two oppositesides of the plurality of first areas AR1 and two opposite sides of theplurality of second areas AR2 extending in the column direction mayoverlap each other, but two opposite sides of the plurality of firstareas AR1 and two opposite sides of the plurality of second areas AR2extending in the row direction may not overlap each other. For example,referring to two second areas AR2 represented by a dotted line and thefirst areas AR1 represented by a bold solid-line in FIG. 2F, two sidesamong four sides of the first area AR1 and the second area AR2 extend inthe column direction on the same line, but other two sides may extend inthe row direction on different lines. Therefore, two second areas AR2may overlap one first area AR1.

In this case, the plurality of second LEDs 122 is not actuallytransferred in a part of second area AR2 which does not overlap thedisplay area AA. Therefore, the plurality of second LEDs 122 may bedisposed only in a part of the area corresponding to the display AA inthe second donor 130B. Alternatively, only the plurality of second LEDs122 in an area corresponding to the display area AA among the pluralityof second LEDs 122 disposed in the entire second donor 130B may betransferred onto the display panel PN.

Referring to FIG. 2G, the plurality of LEDs 120 of the donor 130 istransferred onto the display panel PN. For example, the first donor 130Ais disposed on the display panel PN such that the upper surface of theplurality of first LEDs 121 of the first donor 130A is opposite to thefirst area AR1 of the display panel PN. The plurality of first LEDs 121may be detached from the first donor 130A to be transferred in the firstarea AR1 of the display panel PN. In this case, the plurality of firstalignment keys AK1 may also be selectively transferred onto the displaypanel PN together with the plurality of first LEDs 121 or not.Hereinafter, for the convenience of description, it is assumed that theplurality of alignment keys AK of the donor 130 is transferred onto thedisplay panel PN together with the plurality of LEDs 120.

The A area A illustrated in FIGS. 2H to 2J is the same area as any onefirst area AR1 among the plurality of first areas AR1 as described aboveand may be defined as an area including two second areas AR2 overlappingthe first area AR1.

First, referring to FIG. 2H, the plurality of first LEDs 121 and theplurality of alignment keys AK1 of the first donor 130A are transferredin the A area A which is the first area AR1 of the display panel PN. Inthis case, the plurality of LEDs 120 and the plurality of firstalignment keys AK1 are transferred in the A area A as those are disposedin the first donor 130A. Therefore, the plurality of first LEDs 121 isdisposed in the odd-numbered rows in the A area A and the plurality offirst alignment keys AK1 is disposed to be close to the corner of the Aarea A.

Next, referring to FIG. 2I, the plurality of second LEDs 122 and secondalignment keys AK2 of the second donor 130B are further transferred in apart of the A area A which is the second area AR2 of the display panelPN. In this case, the second area AR2 may overlap the A area A which isthe first area AR1 by approximately ½. Specifically, the plurality ofsecond LEDs 122 of the second donor 130B may be transferred in spacesbetween the plurality of first LEDs 121 disposed in a plurality of rowsin the display panel PN. For example, the plurality of second LEDs 122which is transferred from the second donor 130B onto the display panelPN may be disposed in a sixth row and an eighth row of the A area A ofthe display panel PN. The second alignment keys AK2 of the second donor130B are spaced apart from the plurality of second LEDs 122 in the sixthrow of the A area A with a predetermined interval to be disposed at anupper portion of the plurality of second LEDs 122 of the sixth row andboth ends of a fourth row.

In this case, the corner of the first area AR1 and the corner of thesecond area AR2 do not overlap so that the first alignment key AK1transferred in the first area AR1 does not overlap the second alignmentkey AK2 transferred in the second area AR2.

Referring to FIG. 2J, a plurality of second LEDs 122′ and secondalignment keys AK2′ of the second donor 130B are transferred in anotherpart of the A area A which is the second area AR2 of the display panelPN. In this case, the second donor 130B of FIG. 2J may be a donor inwhich a plurality of second LEDs 122′ is disposed in a wafer differentfrom that of the second donor 130B of FIG. 2I. For example, theplurality of second LEDs 122 is transferred from the first wafer ontothe second donor 130B of FIG. 2I and the plurality of second LEDs 122′is transferred from the second wafer onto the second donor 130B of FIG.2J. Therefore, the plurality of second LEDs 122 and 122′ which emitslight of the same color in the A area A may be grown on the same wafer110 or may be grown on different wafers 110.

Specifically, the plurality of second LEDs 122′ of the second donor 130Bmay be transferred in spaces between the plurality of first LEDs 121disposed in a plurality of rows in the display panel PN in which thesecond LEDs 122 are not disposed. For example, the plurality of secondLEDs 122′ which is transferred from the second donor 130B onto thedisplay panel PN may be disposed in a second row and a fourth row of theA area A of the display panel PN. The second alignment keys AK2′ arespaced apart from the plurality of second LEDs 122 in the fourth row ofthe A area A with a predetermined interval to be disposed at a lowerportion of the plurality of second LEDs 122 of the fourth row and bothends of a fifth row.

Therefore, the plurality of first LEDs 121 transferred from the firstdonor 130A and the plurality of second LEDs 122 and 122′ transferredfrom the second donor 130B are alternately disposed in different rows.Further, the first alignment keys AK1 transferred from the first donor130A may be disposed closely to the corner of the first area AR1 and thesecond alignment keys AK2 and AK2′ transferred from the second donor130B may be disposed between the first alignment keys AK1 of the firstarea AR1, respectively. In this case, the plurality of second LEDs 122and 122′ in the first area AR1 is transferred from different seconddonors 130B and emits light of the same color but may be grown ondifferent wafers 110.

Further, after the plurality of first LEDs 121 and the plurality ofsecond LEDs 122 and 122′ which emit light of the same color arecompletely transferred onto the display panel PN, a plurality of LEDswhich emits light of different colors from that of the plurality of LEDs120 may be transferred between the plurality of LEDs 120 by the same wayas described above. For example, when the plurality of first LEDs 121and the plurality of second LEDs 122 and 122′ emit red light, a processof transferring LEDs which emit blue light or green light may beperformed.

Even though the plurality of LEDs grown on one wafer emits light of thesame color, wavelengths of light which are actually emitted from theplurality of LEDs may be slightly different due to a process error.Accordingly, the color between the plurality of LEDs may not be uniformeven in one wafer and the color between the plurality of LEDs grown ondifferent wafers may not be uniform. In this case, when the plurality ofLEDs of one wafer is transferred onto the display panel so as tocorrespond as it is, a wavelength deviation in the wafer is directlyrepresented on the display panel so that color uniformity of the lightmay not be constant.

Therefore, in the display device and the method of manufacturing adisplay device according to the exemplary embodiment of the presentdisclosure, the plurality of LEDs 120 of one wafer 110 is not directlytransferred onto the display panel PN, but may be transferred so as tobe alternately disposed in the unit of rows. Specifically, the pluralityof LEDs 120 grown on the same wafer 110 may be transferred onto thedisplay panel PN so as to be alternately disposed in the unit of rows.For example, only the plurality of first LEDs 121 disposed in theodd-numbered rows in the wafer 110 is primarily transferred onto thefirst donor 130A and the plurality of first LEDs 121 of the first donor130A may be secondarily transferred in the odd-numbered rows of thefirst area AR1 of the display panel PN. Further, only the plurality ofsecond LEDs 122 disposed in the even-numbered rows in the wafer 110 isprimarily transferred onto the second donor 130B and the plurality ofsecond LEDs 122 of the second donor 130B may be secondarily transferredin the even-numbered rows of the second area AR2 of the display panelPN. Since the first area AR1 and the second area AR2 partially overlap,the plurality of second LEDs 122 may be disposed in some of theeven-numbered rows of the first area AR1 and the even-numbered rows ofthe second area AR2. Accordingly, the plurality of first LEDs 121 andthe plurality of second LEDs 122 grown on the same wafer 110 arealternately disposed in different rows so that the color uniformity inthe display panel PN may be improved.

In some exemplary embodiments, a plurality of wafers 110 on which aplurality of LEDs 120 emitting light of the same color is disposed maybe used for a first transferring process and a second transferringprocess. That is, some of the plurality of LEDs 120 disposed on thefirst wafer among the plurality of wafers 110 are transferred onto thefirst donor 130A and some of the plurality of LEDs 120 disposed on thesecond wafer among the plurality of wafers 110 are transferred onto thesecond donor 130B. In this case, some of the plurality of LEDs 120disposed on the first wafer may be LEDs 120 which are disposed inodd-numbered rows or even-numbered rows, among the plurality of LEDs 120disposed on the first wafer. Further, some of the plurality of LEDs 120disposed on the second wafer among the plurality of wafers 110 may beLEDs 120 which are disposed in even-numbered rows or odd-numbered rows,among the plurality of LEDs 120 disposed on the second wafer.Thereafter, a transferring process onto the display panel PN may beperformed such that the plurality of LEDs 120 which is grown on thefirst wafer and is transferred onto the first donor 130A is transferredin the first area AR1 of the display panel PN and the plurality of LEDs120 which is grown on the second wafer and is transferred onto thesecond donor 130B is transferred in the second area AR2 of the displaypanel PN.

FIGS. 3A to 3G are schematic views of processes for explaining a displaydevice and a method of manufacturing a display device according toanother exemplary embodiment of the present disclosure. A display deviceand a method of manufacturing a display device illustrated in FIGS. 3Ato 3G have the substantially same configuration as the display deviceand the method of manufacturing a display device of FIGS. 2A to 2Jexcept that the arrangement of a plurality of LEDs 120 is different.Therefore, a redundant description will be omitted.

Referring to FIG. 3A, a plurality of first LEDs 321, a plurality ofsecond LEDs 322, and a plurality of alignment keys AK are disposed on awafer 110.

The plurality of first LEDs 321 and the plurality of second LEDs 322 aredisposed in different columns on the wafer 110. For example, theplurality of first LEDs 321 may be disposed on odd-numbered columns andthe plurality of second LEDs 322 may be disposed on even-numberedcolumns.

Referring to FIG. 3B, the plurality of first LEDs 321 among theplurality of LEDs 320 of the wafer 110 is transferred onto the firstdonor 130A. Referring to FIG. 3A, the plurality of first LEDs 321 amongthe plurality of LEDs 320 disposed on the wafer 110 is disposed in theodd-numbered columns. Therefore, only the plurality of first LEDs 321among the plurality of LEDs 320 disposed on the wafer 110 is transferredonto the first donor 130A so that the plurality of first LEDs 321 may bedisposed only on a plurality of first bumps 134 disposed in odd-numberedcolumns among a plurality of first bumps 134 of the first donor 130A.

Referring to FIG. 3C, the plurality of second LEDs 322 among theplurality of LEDs 320 of the wafer 110 is transferred onto the seconddonor 130B. Referring to FIG. 3A, the plurality of second LEDs 322 amongthe plurality of LEDs 320 disposed on the wafer 110 is disposed in theeven-numbered columns. Therefore, only the plurality of second LEDs 322among the plurality of LEDs 320 disposed on the wafer 110 is transferredonto the second donor 130B so that the plurality of second LEDs 322 maybe disposed only on the plurality of first bumps 134 disposed ineven-numbered columns among the plurality of first bumps 134 of thesecond donor 130B.

Referring to FIG. 3D, the plurality of LEDs 320 is transferred in aplurality of first areas AR1 and a plurality of second areas AR2 of thedisplay panel PN.

The plurality of first areas AR1 is areas where the plurality of firstLEDs 321 of the first donor 130A is transferred and the plurality offirst areas AR1 may overlap the entire display area AA. The plurality offirst areas AR1 is disposed in a row direction and a column direction inthe display area AA. For example, an A area A of FIG. 3D is the samearea as one of the first area AR1 of the plurality of first areas AR1.

A plurality of second areas AR2 is areas where the plurality of secondLEDs 322 of the second donor 130B is transferred and the plurality ofsecond areas AR2 may overlap the entire display area AA and a part ofthe non-display area NA. Specifically, the plurality of second areas AR2is disposed in the row direction and the column direction in the displayarea AA and a part of the non-display area NA and the plurality ofsecond areas AR2 may entirely overlap the plurality of first areas AR1.For example, one column in the plurality of first areas AR1 and onecolumn in the plurality of second areas AR2 may be different from eachother even though they are the same one column. The one column in theplurality of second areas AR2 may be disposed more outwardly than theone column of the plurality of first areas AR1. Therefore, two oppositesides of the plurality of first areas AR1 and two opposite sides of theplurality of second areas AR2 extending in the row direction may overlapeach other, but two opposite sides of the plurality of first areas AR1and two opposite sides of the plurality of second areas AR2 extending inthe column direction may not overlap each other. Therefore, two secondareas AR2 may overlap one first area AR1.

Referring to FIG. 3E, the plurality of first LEDs 321 and the pluralityof alignment keys AK1 of the first donor 130A are transferred in the Aarea A which is the first area AR1 of the display panel PN. In thiscase, the plurality of LEDs 320 and the plurality of first alignmentkeys AK1 are transferred in the A area A as those are disposed in thefirst donor 130A. Therefore, the plurality of first LEDs 321 is disposedin the odd-numbered columns in the A area A and the plurality of firstalignment keys AK1 is disposed to be close to the corner of the A areaA.

Referring to FIG. 3F, the plurality of second LEDs 322 and a pluralityof second alignment keys AK2 of the second donor 130B are transferred ina part of the A area A which is the second area AR2 of the display panelPN. In this case, the second area AR2 may overlap the A area A which isthe first area AR1 by approximately ½. The plurality of second LEDs 322and the plurality of second alignment keys AK2 are transferred into apart of the A area A as those are disposed in the second donor 130B.Specifically, the plurality of second LEDs 322 of the second donor 130Bmay be transferred in spaces between the plurality of first LEDs 321disposed in a plurality of columns in the display panel PN. For example,the plurality of second LEDs 322 which is transferred from the seconddonor 130B onto the display panel PN may be disposed in a second columnand a fourth column of the A area A of the display panel PN. The secondalignment keys AK2 of the second donor 130B are spaced apart from theplurality of second LEDs 322 in the fourth column of the A area A with apredetermined interval to be disposed at both ends of a fifth column.

Referring to FIG. 3G, the plurality of second LEDs 322′ and theplurality of second alignment keys AK2′ of the second donor 130B aretransferred in another part of the A area A which is the second area AR2of the display panel PN. In this case, the plurality of second LEDs 322disposed on the second donor 130B in FIG. 3F may be grown on a differentwafer 110 from the plurality of second LEDs 322′ disposed on the seconddonor 130B of FIG. 3G. For example, the plurality of second LEDs 322grown on the first wafer may be transferred onto the second donor 130Bof FIG. 3F and the plurality of second LEDs 322′ grown on the secondwafer may be transferred onto the second donor 130B of FIG. 3G.

Specifically, the plurality of second LEDs 322′ of the second donor 130Bmay be transferred in spaces between the plurality of second LEDs 322disposed in a plurality of columns in the display panel PN in which thesecond LEDs 322 are not disposed. For example, the plurality of secondLEDs 322′ which is transferred from the second donor 130B onto thedisplay panel PN may be disposed in a sixth column and an eighth columnof the A area A of the display panel PN. The second alignment keys AK2′may be spaced apart from the plurality of second LEDs 322 in the sixthcolumn with a predetermined interval to be disposed at both ends of afourth column.

Therefore, the plurality of first LEDs 321 transferred from the firstdonor 130A and the plurality of second LEDs 322 and 322′ transferredfrom the second donor 130B are alternately disposed in differentcolumns. Further, the first alignment keys AK1 transferred from thefirst donor 130A may be disposed closely to the corner of the first areaAR1 and the second alignment keys AK2 and AK2′ transferred from thesecond donor 130B may be disposed between the first alignment keys AK1of the first area AR1, respectively. In this case, the plurality ofsecond LEDs 322 and 322′ in the first area AR1 is transferred fromdifferent second donors 130B and emits light of the same color but maybe grown on different wafers 110.

Therefore, in the display device and the method of manufacturing adisplay device according to another exemplary embodiment of the presentdisclosure, the plurality of LEDs 320 of one wafer 110 is nottransferred as it is onto the display panel PN, but may be transferredso as to be alternately disposed in the unit of columns. Specifically,the plurality of LEDs 320 grown on the same wafer 110 or differentwafers 110 may be transferred onto the display panel PN so as to bealternately disposed in the unit of columns. For example, only theplurality of first LEDs 321 disposed in the odd-numbered columns in thewafer 110 is primarily transferred onto the first donor 130A and theplurality of first LEDs 321 of the first donor 130A may be secondarilytransferred in the odd-numbered columns of the first area AR1 of thedisplay panel PN. Further, only the plurality of second LEDs 322 and322′ disposed in the even-numbered columns in the wafer 110 is primarilytransferred onto the second donor 130B and the plurality of second LEDs322 and 322′ of the second donor 130B may be secondarily transferred inthe even-numbered columns of the second area AR2 of the display panelPN. Since the first area AR1 and the second area AR2 partially overlap,the plurality of second LEDs 322 and 322′ may be disposed in some of theeven-numbered columns of the first area AR1 and the even-numberedcolumns of the second area AR2. Accordingly, the plurality of first LEDs321 and the plurality of second LEDs 322 and 322′ grown on differentwafers 110 or the same wafer 110 are alternately disposed in differentcolumns so that the color uniformity in the display panel PN may beimproved.

FIGS. 4A to 4H are schematic views of processes for explaining a displaydevice and a method of manufacturing a display device according to stillanother exemplary embodiment of the present disclosure; A display deviceand a method of manufacturing a display device illustrated in FIGS. 4Ato 4H have the substantially same configuration as the display deviceand the method of manufacturing a display device of FIGS. 2A to 2Jexcept that the arrangement of a plurality of LEDs 420 is different.Therefore, a redundant description will be omitted.

Referring to FIG. 4A, a plurality of first LEDs 421, a plurality ofsecond LEDs 422, and a plurality of alignment keys AK are disposed on awafer 110.

The plurality of first LEDs 421 and the plurality of second LEDs 422 arealternately disposed in the same row and the same column on the wafer110. For example, the plurality of first LEDs 421 is disposed only inodd-numbered columns in odd-numbered rows and only in even-numberedcolumns in even-numbered rows and the plurality of second LEDs 422 isdisposed only in even-numbered columns in odd-numbered rows and only inodd-numbered columns in even-numbered rows. Therefore, the plurality offirst LEDs 421 and the plurality of second LEDs 422 may form a mosaicpattern on the wafer 110.

Referring to FIG. 4B, a plurality of first LEDs 421 among the pluralityof LEDs 420 of the wafer 110 is transferred onto a first donor 130A.Referring to FIG. 4A, the plurality of first LEDs 421 among theplurality of LEDs 420 disposed on the wafer 110 is disposed in theodd-numbered columns in the odd-numbered rows and in the even-numberedcolumns in the even-numbered rows. Therefore, only the plurality offirst LEDs 421 among the plurality of LEDs 420 disposed on the wafer 110is transferred onto the first donor 130A so that the plurality of firstLEDs 421 may be disposed only on a plurality of first bumps 134 disposedin odd-numbered rows and odd-numbered columns and a plurality of firstbumps 134 disposed in even-numbered rows and even-numbered columns amonga plurality of first bumps 134 of the first donor 130A. Therefore, theplurality of first LEDs 421 may form a mosaic pattern in the first donor130A.

Referring to FIG. 4C, the plurality of second LEDs 422 among theplurality of LEDs 420 of the wafer 110 is transferred onto the seconddonor 130B. Referring to FIG. 4A, the plurality of second LEDs 422 amongthe plurality of LEDs 420 disposed on the wafer 110 is disposed in theeven-numbered columns in the odd-numbered rows and in the odd-numberedcolumns in the even-numbered rows. Therefore, only the plurality offirst LEDs 422 among the plurality of LEDs 420 disposed on the wafer 110is transferred onto the second donor 130B so that the plurality ofsecond LEDs 422 may be disposed only on a plurality of first bumps 134disposed in odd-numbered rows and even-numbered columns and a pluralityof first bumps 134 disposed in even-numbered rows and odd-numberedcolumns among a plurality of first bumps 134 of the second donor 130B.Therefore, the plurality of second LEDs 422 may form a mosaic pattern inthe second donor 130B.

Referring to FIG. 4D, the plurality of LEDs 420 is transferred in theplurality of first areas AR1 and a plurality of second areas AR2 of thedisplay panel PN.

A plurality of first areas AR1 is areas where the plurality of firstLEDs 421 of the first donor 130A is transferred and the plurality offirst areas AR1 may overlap the entire display area AA and a part of thenon-display area NA. Specifically, the plurality of first areas AR1 isdisposed in the row direction and the column direction in the displaypanel PN. For example, some of the plurality of first areas AR1 disposedin an outermost left column may overlap a boundary of the display areaAA and the non-display area NA and some of the plurality of first areasAR1 disposed in an outermost right column may overlap the boundary ofthe display area AA and the non-display area NA.

A plurality of second areas AR2 is areas where the plurality of secondLEDs 422 of the second donor 130B is transferred and the plurality ofsecond areas AR2 may overlap the entire display area AA and a part ofthe non-display area NA. Specifically, the plurality of second areas AR2is disposed in the row direction and the column direction in the displaypanel PN. For example, some of the plurality of second areas AR2disposed in an uppermost row may overlap the boundary of the displayarea AA and the non-display area NA and some of the plurality of secondareas AR2 disposed in a lowermost row may overlap the boundary of thedisplay area AA and the non-display area NA.

In this case, the plurality of LEDs 420 is not actually transferred in apart of the first area AR1 and the second area AR2 which do not overlapthe display area AA. Therefore, the plurality of LEDs 420 may bedisposed only in a part of the area corresponding to the display AA inthe first donor 130A and the second donor 130B which transfer theplurality of LEDs 420 in some of the plurality of first areas AR1 andthe plurality of second areas AR2 which overlap the boundary of thedisplay area AA and the non-display area. Alternatively, only theplurality of second LEDs 422 in an area corresponding to the displayarea AA among the plurality of LEDs 420 disposed in the entire firstdonor 130A and second donor 130B may be transferred onto the displaypanel PN.

The plurality of second areas AR2 may partially overlap the plurality offirst areas AR1. Specifically, one of the first areas AR1 and one of thesecond areas AR2 may partially overlap in the row direction and thecolumn direction. One row and one column in the plurality of first areasAR1 and one row and one column in the plurality of second areas AR2 maybe different from each other even though they are the same one row andone column. For example, one column of the plurality of first areas AR1may be disposed more outwardly than one column of the plurality ofsecond area AR2 and one row of the plurality of second areas AR2 may bedisposed more outwardly than one row of the plurality of first areasAR1. Therefore, four sides of the plurality of first areas AR1 and foursides of the plurality of second areas AR2 extending in the rowdirection and the column direction, respectively do not match.Therefore, four second areas AR2 may overlap one first area AR1 and onecorner of the first area AR1 may be disposed in the second area AR2.

Referring to FIG. 4E, the plurality of first LEDs 421 and the pluralityof alignment keys AK1 of the first donor 130A are transferred in a partof the A area A which is the first area AR1 of the display panel PN. Inthis case, the first area AR1 may overlap the A area A by approximately½. The plurality of first LEDs 421 and the plurality of first alignmentkeys AK1 are transferred in a part of the A area A as those are disposedin the first donor 130A. Therefore, the plurality of first LEDs 421 maybe disposed in a first column and a third column in an odd-numbered rowof the A area A and may be disposed in a second column and a fourthcolumn in an even-numbered row and the plurality of alignment keys AK1may be disposed at both ends of a fifth column of the A area A.

Referring to FIG. 4F, a plurality of first LEDs 421′ and a plurality ofalignment keys AK1′ of the first donor 130A are transferred in anotherpart of the A area A which is the first area AR1 of the display panelPN. In this case, the first area AR1 may overlap the remaining area ofthe A area A by approximately ½. The plurality of first LEDs 421′ andthe plurality of first alignment keys AK1′ are transferred into anotherpart of the A area A as those are disposed in the first donor 130A.Therefore, the plurality of first LEDs 421′ may be disposed in a fifthcolumn and a seventh column in an odd-numbered row of the A area A andmay be disposed in a sixth column and an eighth column in aneven-numbered row and the plurality of alignment keys AK1′ may bedisposed at both ends of a fourth column of the A area A.

Further, the plurality of first LEDs 421′ disposed on the first donor130A in FIG. 4F may be grown on a different wafer 110 from the pluralityof first LEDs 421 disposed on the first donor 130A of FIG. 4E. Forexample, the plurality of first LEDs 421 grown on the first wafer may betransferred onto the first donor 130A of FIG. 4E and the plurality offirst LEDs 421′ grown on the second wafer may be transferred onto thefirst donor 130A of FIG. 4F.

Referring to FIG. 4G, the plurality of second LEDs 422 and a pluralityof second alignment keys AK2 of the second donor 130B are transferredonto a part of the A area A which is the second area AR2 of the displaypanel PN. In this case, the second area AR2 may overlap a part of the Aarea A by approximately ½. The plurality of second LEDs 422 and theplurality of second alignment keys AK2 are transferred into a part ofthe A area A as those are disposed in the second donor 130B. Therefore,the plurality of second LEDs 422 may be disposed in a sixth row and aneighth row in an odd-numbered column of the A area A and may be disposedin a fifth row and a seventh row in an even-numbered column and theplurality of second alignment keys AK2 may be disposed at both ends of afourth row of the A area A.

Referring to FIG. 4H, the plurality of second LEDs 422′ and theplurality of second alignment keys AK2′ of the second donor 130B arefurther transferred onto another part of the A area A which is thesecond area AR2 of the display panel PN.

In this case, the second area AR2 may overlap the remaining area of theA area A by approximately ½. The plurality of second LEDs 422′ and theplurality of second alignment keys AK2′ are transferred in another partof the A area A as those are disposed in the second donor 130B.Therefore, the plurality of second LEDs 422′ may be disposed in a secondrow and a fourth row in an odd-numbered column of the A area A and maybe disposed in a first row and a third row in an even-numbered columnand the plurality of second alignment keys AK2′ may be disposed at bothends of a fifth row.

The plurality of second LEDs 422 of the second donor 130B in FIG. 4G maybe grown on a different wafer 110 from the plurality of second LEDs 422′of the second donor 130B of FIG. 4H. For example, the plurality of firstLEDs 421 grown on the first wafer may be transferred onto the seconddonor 130B of FIG. 4G and the plurality of second LEDs 422′ grown on thesecond wafer may be transferred onto the second donor 130B of FIG. 4H.

Therefore, in the display device and the method of manufacturing adisplay device according to another exemplary embodiment of the presentdisclosure, the plurality of LEDs 420 of one wafer 110 is not directlytransferred onto the display panel PN, but may be transferred so as tobe alternately disposed in the same row and the same column.Specifically, the plurality of LEDs 420 grown on the same wafer 110 ordifferent wafers 110 may be transferred onto the display panel PN so asto be alternately disposed in the rows and the columns. Therefore, theplurality of first LEDs 421 and 421′ and the plurality of second LEDs422 and 422′ which are finally transferred onto the display panel PN maybe alternately disposed both in the row direction and the columndirection. Therefore, the plurality of first LEDs 421 and 421′ grown ondifferent wafers 110 or the same wafer 110 may be transferred onto thefirst donor 130A and the display panel PN to form a mosaic pattern.Further, the plurality of second LEDs 422 and 422′ grown on differentwafers 110 or the same wafer 110 may be transferred onto the seconddonor 130B and the display panel PN to form a mosaic pattern which isdifferent from the mosaic pattern of the first LEDs 421.

Hereinafter, effects of the display device and the method ofmanufacturing a display device according to various exemplaryembodiments of the present disclosure will be described in detail withreference to FIGS. 5A to 5F.

FIGS. 5A to 5D are views for explaining effects of a display device anda method of manufacturing a display device according to variousexemplary embodiments of the present disclosure by comparing with adisplay device and a method of manufacturing a display device accordingto a comparative example. FIG. 5A is a view illustrating a wavelengthdistribution between a plurality of LEDs on a wafer. FIG. 5B is a viewillustrating a wavelength distribution of a plurality of LEDs disposedin a display panel according to a display device and a method ofmanufacturing a display device according to a comparative example. FIG.5C is a view illustrating a wavelength distribution of a plurality ofLEDs disposed in a display panel according to a display device and amethod of manufacturing a display device according to an exemplaryembodiment of the present disclosure. FIG. 5D is a view illustrating awavelength distribution of a plurality of LEDs disposed in a displaypanel according to a display device and a method of manufacturing adisplay device according to another exemplary embodiment of the presentdisclosure.

Referring to FIG. 5A, a wavelength distribution of a plurality of LEDsgrown on one wafer may vary. A plurality of LEDs which emits light ofthe same color may be grown on one wafer. However, even though the LEDsare grown on one wafer, wavelengths of light actually emitted from theLED may slightly vary due to a process error. Therefore, when theplurality of LEDs grown on one wafer is directly primarily transferredonto a donor and the plurality of LEDs of the donor is directlysecondarily transferred on a display panel, the wavelength distributionsbetween the plurality of LEDs in the wafer may be directly representedonto the display panel.

Referring to FIG. 5B, in a display device and a method of manufacturinga display device according to a comparative example, a plurality of LEDsof a wafer is directly transferred onto one donor and the plurality ofLEDs transferred onto the one donor is transferred onto a display panelagain. Even in an area where one donor transfers the plurality of LEDsin the display panel, the wavelength distributions between the pluralityof LEDs are different so that the color of the light emitted from theplurality of LEDs may not be uniform. Further, between an area where onewafer and one donor transfer a plurality of LEDs in the display paneland an area where the other wafer and the other donor transfer theplurality of LEDs and at a boundary between the areas, the color of thelight emitted from the plurality of LEDs may not be uniform.

In the display device and the method of manufacturing a display deviceaccording to a comparative example, the plurality of LEDs is transferredonto the display panel as those are disposed on a plurality of wafers.Therefore, even in the display panel, the wavelength distribution ofeach of the plurality of LEDs of the plurality of wafers may be shown inform of tiles and the color deviation may be easily perceived by theviewer.

Referring to FIG. 5C, it is understood that the wavelength distributionsof the plurality of LEDs 120 disposed in the display panel PN of thedisplay device according to an exemplary embodiment of the presentdisclosure is improved as compared with the display device according tothe comparative example of FIG. 5B. As described with reference to FIGS.2A to 2J above, in the display device and the method of manufacturing adisplay device according to the exemplary embodiment of the presentdisclosure, a plurality of first LEDs 121 disposed in the odd-numberedrows among the plurality of LEDs 120 grown on one wafer 110 istransferred onto the first donor 130A and a plurality of second LEDs 122and 122′ disposed in the even-numbered rows is transferred onto thesecond donor 130B. The plurality of first LEDs 121 of the first donor130A is transferred onto the display panel PN and the plurality ofsecond LEDs 122 and 122′ of the second donor 130B is transferred in thespace between the plurality of first LEDs 121 disposed in the pluralityof rows. Therefore, the plurality of LEDs 120 grown on one wafer 110 istransferred onto the display panel PN to be alternately disposed in theunit of rows so that the wavelength deviation between the plurality ofLEDs 120 on the wafer is not directly represented on the display panelPN. But the color uniformity of the light emitted from the plurality ofLEDs 120 in the display panel PN may be improved. Since the coloruniformity is improved, the deviation between the plurality of LEDs 120is not recognized by the viewers and reliability of the display deviceis also improved.

Referring to FIG. 5D, it is understood that the wavelength distributionsof the plurality of LEDs 420 disposed in the display panel PN of thedisplay device according to another exemplary embodiment of the presentdisclosure is improved in the color uniformity as compared with thedisplay device according to the comparative example of FIG. 5B. Asdescribed with reference to FIGS. 4A to 4H above, in the display deviceand the method of manufacturing a display device according to anotherexemplary embodiment of the present disclosure, a plurality of firstLEDs 421 and 421′ formed by a mosaic pattern among the plurality of LEDs420 grown on one wafer 110 is transferred onto the first donor 130A anda plurality of second LEDs 422 and 422′ formed by a different mosaicpattern from that of the plurality of first LEDs 421 and 421′ istransferred onto the second donor 130B. The plurality of first LEDs 421and 421′ of the first donor 130A is transferred onto the display panelPN and the plurality of second LEDs 422 and 422′ of the second donor130B is transferred onto the display panel PN to be alternately disposedboth in the row direction and the column direction. Therefore, theplurality of LEDs 420 grown on one wafer 110 is transferred onto thedisplay panel PN to be alternately disposed in the mosaic pattern sothat the wavelength deviation between the plurality of LEDs 420 on thewafer 110 is not represented on the display panel PN. But the coloruniformity of the light emitted from the plurality of LEDs 420 in thedisplay panel PN may be improved. Since the color uniformity isimproved, the deviation between the plurality of LEDs 420 is notrecognized by the viewers and reliability of the display device is alsoimproved.

In the display device and the method of manufacturing a display deviceaccording to various exemplary embodiments of the present disclosure,even though there is a large difference in a wavelength between theplurality of LEDs 120, 320, and 420 on the wafer 110, the plurality ofLEDs 120, 320, and 420 may be uniformly mixed during the transferringprocess.

Therefore, an allowable range of the wavelength difference between theplurality of LEDs 120, 320, and 420 grown on one wafer 110 may beincreased. Therefore, since the plurality of LEDs 120, 320, and 420which has been determined to be defective in the related art may be usedfor the display panel PN, a manufacturing cost may be reduced.

FIGS. 6A to 6C are views for explaining features of a display deviceaccording to various exemplary embodiments of the present disclosure.FIG. 6A is a plan view of a first donor and a display panel when aplurality of LEDs of the first donor is transferred onto a displaypanel. FIG. 6B is a view illustrating a movement of an alignment key ina display panel according to a display device and a method ofmanufacturing a display device of FIGS. 2A to 2J. FIG. 6C is a viewillustrating a movement of an alignment key in a display panel accordingto a display device and a method of manufacturing a display device ofFIGS. 4A to 4H. In FIG. 6A, for the convenience of description, only thefirst alignment key AK1 of a first donor 130A is illustrated.

Referring to FIG. 6A, in order to transfer the plurality of LEDs 120 andthe first alignment keys AK1 of the first donor 130A onto the displaypanel PN, after loading the first donor 130A on the display panel PN, apressure is applied to the first donor 130A. In this case, the adheringlayer 132A and the plurality of bumps 133A of the first donor 130A maybe formed of a flexible material such as PDMS, PUA, PEG, epoxy resin, orurethane resin, as described above. Therefore, as the pressure isapplied to the first donor 130A, the adhering layer 132A and theplurality of bumps 133A may be deformed.

For example, when the first donor 130A is a rectangular shape, the firstdonor 130A may extend in a major axis direction and may be shortened ina minor axis direction. Therefore, the first alignment key AK1 of thefirst donor 130A moves outwardly from the first donor 130A in the majoraxis direction and the first alignment keys AK1 moves inwardly from thefirst donor 130A in the minor axis direction. Specifically, the firstalignment keys AK1 disposed in the row direction in the first donor 130Amove to be close to each other and the first alignment keys AK1 disposedin the column direction move to be spaced apart from each other.However, a deformed shape of the first donor 130A and a movementdirection of the first alignment keys AK1 may vary depending on a shapeof the first donor 130A and is not limited thereto.

In the meantime, an interval between the first alignment keys AK1 andsome of the plurality of LEDs 120 is always constant. For example, theinterval between the first alignment key AK1 and the LED 120 disposed atthe shortest distance may always be constant. Therefore, the pluralityof LEDs 120 may also move in the movement direction of the firstalignment keys AK1. Therefore, a transferring position of the firstdonor 130A may be identified through the movement direction of the firstalignment key AK1. Further, even though the first alignment keys AK1 arenot transferred onto the display panel PN, the transferring position ofthe first donor 130A may be identified through the movement direction ofthe plurality of LEDs 120.

Hereinafter, movement of the alignment keys AK according to thetransferring position of the donor 130 will be described in more detailwith reference to FIGS. 6B and 6C. In this case, for the convenience ofdescription, it is assumed that the plurality of alignment keys AK ofthe donor 130 is transferred onto the display panel PN and only thealignment key AK is illustrated on the display panel PN.

Referring to FIG. 6B, a plurality of first alignment keys AK1transferred from the first donor 130A is disposed at corners of theplurality of first areas AR1 and a plurality of second alignment keysAK2 transferred from the second donor 130B is disposed at corners of aplurality of second areas AR2. Some of two sides of one first area AR1may partially overlap some of two sides of one second area AR2. That is,a partial area of the first area AR1 and a partial area of the secondarea AR2 may vertically overlap.

First, the first alignment key AK1 transferred from the first donor 130Aonto the display panel PN may be moved to be close to the firstalignment key AK1 disposed in an adjacent row. Further, the firstalignment key AK1 may be moved to be spaced apart from the firstalignment key AK1 disposed in an adjacent column.

Therefore, in the plurality of first LEDs 121 transferred from the firstdonor 130A onto the display panel PN, similarly to the movementdirection of the first alignment key AK1, an interval between a firstLEDs 121 disposed in a specific row and a first LEDs 121 disposed in arow adjacent to the specific row is the smallest and an interval betweena first LED 121 disposed in a specific column and a first LED 121disposed in a column adjacent to the specific column is the largest.Therefore, the intervals between the plurality of first LEDs 121disposed on the same row or the same column may not be constant.

Similarly to the first alignment key AK1, a second alignment key AK2transferred from the second donor 130B onto the display panel PN maymove to be close to the second alignment key AK2 disposed in an adjacentrow. Further, the second alignment key AK2 may move to be spaced apartfrom the second alignment key AK2 disposed in an adjacent column.

Therefore, in the plurality of second LEDs 122 transferred from thesecond donor 130B onto the display panel PN, similarly to the movementdirection of the second alignment key AK2, an interval between a secondLEDs 122 disposed in a specific row and a second LED 122 disposed in arow adjacent to the specific row is the smallest and an interval betweena second LED 122 disposed in a specific column and a second LED 122disposed in a column adjacent to the specific column is the largest.Therefore, the intervals between the plurality of second LEDs 122disposed on the same row or the same column may not be constant.

In the meantime, the plurality of first LEDs 121 and the plurality ofsecond LEDs 122 are disposed in different rows and alternately disposedon the same column. As described above, the plurality of first alignmentkeys AK1 disposed in a first column CL1 and a plurality of firstalignment keys AK1 disposed in a second column CL2 adjacent to the firstcolumn CL1 move to be spaced apart from each other. Similarly, theplurality of second alignment keys AK2 disposed in the first column CL1and a plurality of second alignment keys AK2 disposed in a second columnCL2 move to be spaced apart from each other. For example, referring toFIG. 6B, when it is assumed that a first column CL1 and a second columnCL2 are adjacent to each other in two first areas AR1 adjacent in therow direction, the plurality of first alignment keys AK1 disposed in thefirst column CL1 and the plurality of first alignment keys AK1 disposedin the second column CL2 may move to be spaced apart from each other.Further, when it is assumed that a first column CL1 and a second columnCL2 are adjacent to each other in two second areas AR2 adjacent in therow direction, the plurality of second alignment keys AK2 disposed inthe first column CL1 and the plurality of second alignment keys AK2disposed in the second column CL2 may also move to be spaced apart fromeach other.

The plurality of first LEDs 121 moves in the same direction as the firstalignment key AK1 and the plurality of second LEDs 122 moves in the samedirection as the second alignment key AK2. Therefore, an intervalbetween the plurality of first LEDs 121 disposed in the first column CL1and the plurality of first LEDs 121 disposed in the second column CL2may be larger than the interval between the plurality of other firstLEDs 121. Therefore, an interval between the plurality of second LEDs122 disposed in the first column CL1 and the plurality of second LEDs122 disposed in the second column CL2 may be larger than the intervalbetween the plurality of other second LEDs 122. Accordingly, theinterval between the plurality of first LEDs 121 is the largest at theboundary of the first areas AR1 adjacent to each other in row directionand the interval between the plurality of second LEDs 122 may be thelargest at the boundary of the second areas AR2 adjacent to each otherin row direction.

Referring to FIG. 6C, a plurality of first alignment keys AK1transferred from the first donor 130A is disposed at corners of theplurality of first areas AR1 and a plurality of second alignment keysAK2 transferred from the second donor 130B is disposed at corners of aplurality of second areas AR2. One of corners of one first area AR1 maybe disposed in one second area AR2 and one of corners of one second areaAR2 may be disposed in one first area AR1. That is, four second areasAR2 may overlap one first area AR1.

The first alignment key AK1 transferred from the first donor 130A ontothe display panel PN may move to be close to the first alignment key AK1disposed in an adjacent row. Further, the first alignment key AK1 maymove to be spaced apart from the first alignment key AK1 disposed in anadjacent column. Therefore, an interval between the first LED 421disposed in a specific row and a first LED 421 disposed in an adjacentrow may be the smallest.

In the meantime, similarly to the first alignment key AK1, a secondalignment key AK2 transferred from the second donor 130B onto thedisplay panel PN may move to be close to the second alignment key AK2disposed in an adjacent row. Further, the second alignment key AK2 maymove to be spaced apart from the second alignment key AK2 disposed in anadjacent column. Therefore, an interval between the second LED 422disposed in a specific row and a second LED 422 disposed in an adjacentrow may be the smallest.

In the meantime, the plurality of first LEDs 421 and the plurality ofsecond LEDs 422 are alternately disposed in the same row and alternatelydisposed in the same column. In this case, the plurality of firstalignment keys AK1 and the plurality of second alignment keys AK2 may bedisposed in different rows and different columns. Therefore, when theinterval between the plurality of first LEDs 421 disposed in thespecific row and the plurality of first LEDs 421 disposed in theadjacent row is the smallest, the interval between the plurality ofsecond LEDs 422 disposed in the specific row and the plurality of secondLEDs 422 disposed in the adjacent row may not be the smallest.Therefore, among the plurality of first LEDs 421 and the plurality ofsecond LEDs 422 disposed in the same row, the plurality of first LEDs421 may be disposed to be closer to the LED 420 in the adjacent row orthe plurality of second LEDs 422 may be disposed to be closer to the LED420 in the adjacent row.

In the display device and the method of manufacturing a display deviceaccording to various exemplary embodiments of the present disclosure,the transferring area of the donor 130 may be identified using adirectivity of the plurality of alignment keys AK and the plurality ofLEDs 120, 320, and 420 transferred onto the display panel PN. Forexample, the interval of the plurality of LEDs 120, 320, and 420transferred from different donors 130 may be largest or smallest at theboundary depending on a deformation shape of the donor 130. Further,when the plurality of LEDs 120, 320, and 420 disposed in the same areais transferred from different donors, the plurality of LEDs may havedifferent directivities. Therefore, centers of the plurality of LEDs120, 320, and 420 disposed in the same row or the same column may not bedisposed on the same line. As described above, the transferring area maybe identified from the directivity of the plurality of LEDs 120, 320,and 420 and/or the plurality of alignment keys AK transferred onto thedisplay panel PN.

The display device according to various exemplary embodiments of thepresent disclosure will be described as follows:

According to an aspect of the present disclosure, a display deviceincludes a display panel which includes a plurality of sub-pixelsdisposed in a plurality of rows and a plurality of columns and aplurality of first LEDs and a plurality of second LEDs disposed in theplurality of sub-pixels in which the plurality of first LEDs and theplurality of second LEDs are alternately disposed in a row direction ora column direction.

According to another aspect of the present disclosure, the plurality offirst LEDs may be disposed in a plurality of first rows of the displaypanel, the plurality of second LEDs may be disposed in a plurality ofsecond rows between the plurality of first rows, intervals between theplurality of first LEDs disposed in the same first row may not beconstant, and intervals between the plurality of second LEDs disposed inthe same second row may not be constant.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the display device and themethod of manufacturing the same of the present disclosure withoutdeparting from the technical idea or scope of the disclosure. Thus, itis intended that the present disclosure cover the modifications andvariations of this disclosure provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A method of manufacturing a display device,comprising: a first transferring step of transferring a plurality ofLEDs disposed on a wafer onto a plurality of donors; and a secondtransferring step of transferring the plurality of LEDs transferred ontothe plurality of donors onto a display panel, wherein in the secondtransferring step, an area where one of the plurality of donors overlapsthe display panel partially overlaps an area where the other one of theplurality of donors overlaps the display panel.
 2. The method accordingto claim 1, wherein the plurality of donors includes a first donor and asecond donor, and wherein the first transferring step includes:transferring a plurality of first LEDs among the plurality of LEDsdisposed on the wafer onto the first donor; and transferring a pluralityof second LEDs among the plurality of LEDs disposed on the wafer ontothe second donor.
 3. The method according to claim 2, wherein theplurality of first LEDs and the plurality of second LEDs are disposed indifferent rows on the wafer.
 4. The method according to claim 2, whereinthe plurality of first LEDs and the plurality of second LEDs aredisposed in different columns on the wafer.
 5. The method according toclaim 2, wherein the plurality of first LEDs and the plurality of secondLEDs are alternately disposed in the same row and alternately disposedin the same column, on the wafer.
 6. The method according to claim 2,wherein the second transferring step includes: transferring theplurality of first LEDs of the first donor in a plurality of first areasof the display panel; and transferring the plurality of second LEDs ofthe second donor in a plurality of second areas of the display panel,and the first area and the second area partially overlap.
 7. The methodaccording to claim 6, wherein the plurality of first LEDs is disposed ina plurality of rows in the display panel, and wherein the transferringof the plurality of second LEDs of the second donor includestransferring the plurality of second LEDs in a space between theplurality of rows.
 8. The method according to claim 6, wherein theplurality of first LEDs is disposed in a plurality of columns in thedisplay panel, and wherein the transferring of the plurality of secondLEDs of the second donor includes transferring the plurality of secondLEDs in a space between the plurality of columns.
 9. The methodaccording to claim 6, wherein the transferring of the plurality ofsecond LEDs of the second donor includes: transferring the plurality ofsecond LEDs such that the plurality of first LEDs and the plurality ofsecond LEDs are alternately disposed both in a row direction and acolumn direction.
 10. A method of manufacturing a display device,comprising: transferring some of a plurality of LEDs disposed on a firstwafer onto a first donor; transferring the other of the plurality ofLEDs disposed in the first wafer or some of the plurality of LEDsdisposed on a second wafer onto a second donor; transferring theplurality of LEDs transferred onto the first donor in a first area of adisplay panel; and transferring the plurality of LEDs transferred ontothe second donor in a second area of the display panel, wherein thefirst area and the second area at least partially overlap each other toimprove color uniformity between the plurality of LEDs.
 11. The methodaccording to claim 10, wherein the transferring onto a first donorincludes: transferring a plurality of LEDs disposed in odd-numberedlines or even-numbered lines among the plurality of LEDs disposed in thefirst wafer onto the first donor, and wherein the transferring onto asecond donor includes: transferring a plurality of LEDs disposed in adifferent line from the line transferred onto the first donor among theplurality of LEDs disposed on the first wafer or a plurality of LEDsdisposed in odd-numbered lines or even-numbered lines among theplurality of LEDs disposed in the second wafer onto the second donor.12. The method according to claim 11, wherein the plurality of LEDs isdisposed in odd-numbered lines or even-numbered lines in the first area,and wherein the transferring in a second area includes: transferring theplurality of LEDs of the second donor in at least partial space of aspace between the odd-numbered lines or at least partial space of aspace between the even-numbered lines.
 13. The method according to claim10, wherein the transferring onto a first donor includes: transferring aplurality of LEDs which forms a mosaic pattern among the plurality ofLEDs disposed in the first wafer onto the first donor, and wherein thetransferring onto a second donor includes: transferring a plurality ofLEDs which forms a different mosaic pattern from the pattern transferredonto the first donor among the plurality of LEDs disposed on the firstwafer or a plurality of LEDs which forms a mosaic pattern among theplurality of LEDs disposed on the second wafer onto the second donor.14. The method according to claim 13, wherein the plurality of LEDs isdisposed in the first area to form a mosaic pattern, and wherein thetransferring onto a second area includes: transferring the plurality ofLEDs of the second donor in a space between the mosaic patterns.
 15. Themethod according to claim 10, wherein the transferring onto a firstdonor includes: transferring a plurality of alignment keys disposed onthe first wafer onto the first donor, and wherein the transferring ontoa second donor includes: transferring the plurality of alignment keysdisposed on the first wafer or the second wafer onto the second donor.16. The method according to claim 15, wherein the transferring in afirst area includes: transferring the plurality of alignment keysdisposed in the first donor in the first area, wherein the transferringin a second area includes: transferring the plurality of alignment keysdisposed in the second donor in the second area, and wherein theplurality of alignment keys transferred from the first donor in thefirst area does not overlap the plurality of alignment keys transferredfrom the second donor in the second area.
 17. The method according toclaim 10, wherein at least a part of at least two sides of the firstarea overlaps two sides of the second area.
 18. The method according toclaim 10, wherein one corner of the first area is disposed in the secondarea.